FreeLists / pcdlist / [pcdlist] Re: Thru hole components

[Rob Mongey <rmongey@xxxxxxxxxx>]

Intrusive Reflow is what I believe is being described here.

We looked at it, but the problem was that not many through hole components 
(transformers, buzzers in particular) can withstand the temperatures involved.



At 12:57 10/05/02 -0500, you wrote:


>I've heard of this being done before but how well does it work? Is there
>enough solder flow available to form a proper fillet? As unconventional as
>it may sound, it could save assembly $. Any info on it's reliability or an
>IPC spec?
>Ron Olinyk, CID
>
>At 04:56 AM 5/10/02 -0700, you wrote:
>
> >Lots of good points made here regarding combined hole sizes.
> >The only thing I have not seen mentioned is how it would effect a combined
> >soldering process. I have been requested by our internal manufacturing guys
> >(now it's external) to define hole sizes that would allow the through hole
> >components to be soldered at the same time the SMT parts are. They requested
> >that any through hole components maintain their sizes in the .006 to .010
> >over lead dia.
> >This would allow solder paste to be screened into the holes at the same time
> >it is applied to the SMT pads. Woolaaa......... both component types, one
> >process. These foot print, pad stack, geometry, parts or what ever else you
> >may call them are not to be used for a wave soldering process.
> >
> >John Shaub CID
> >Honeywell IS
> >Fort Washington, PA
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                                                      Regards,
                                                           Rob Mongey.
                                                           PCB Designer.

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