FreeLists / pcdlist / [pcdlist] Re: Thru hole components

[john.shaub@xxxxxxxxxxxxx]

After talking to my New Product Introduction Engineer, I have learned that
our off shore contract manufacture is not using the process once used in our
own state side assembly plant. He stated that the reliability was high and
drove the cost of the assembly down. Keep in mind that these boards are not
through hole boards with some surface mount parts. They are surface mount
boards with a few through hole components, like two or three connectors
which had to be bought made from plastic that would withstand the heat
involved to solder the board, and few components that were not available in
a surface mount package. I am still told to design my boards with the same
rules applied. They feel eventually our contract manufactures will begin
using the process it is designed for.

As I stated earlier, that these parts are not meant for wave soldering;
evidently they are either sending these over or soldering them by hand, with
no complaint, and believe me they will complain.

John Shaub CID
Honeywell IS
Fort Washington, PA.


-----Original Message-----
From: Ron Olinyk [mailto:rolinyk@xxxxxxxxxxxxx]
Sent: Friday, May 10, 2002 1:58 PM
To: pcdlist@xxxxxxxxxxxxx
Subject: [pcdlist] Re: Thru hole components



I've heard of this being done before but how well does it work? Is there 
enough solder flow available to form a proper fillet? As unconventional as 
it may sound, it could save assembly $. Any info on it's reliability or an 
IPC spec?
Ron Olinyk, CID

At 04:56 AM 5/10/02 -0700, you wrote:

>Lots of good points made here regarding combined hole sizes.
>The only thing I have not seen mentioned is how it would effect a combined
>soldering process. I have been requested by our internal manufacturing guys
>(now it's external) to define hole sizes that would allow the through hole
>components to be soldered at the same time the SMT parts are. They
requested
>that any through hole components maintain their sizes in the .006 to .010
>over lead dia.
>This would allow solder paste to be screened into the holes at the same
time
>it is applied to the SMT pads. Woolaaa......... both component types, one
>process. These foot print, pad stack, geometry, parts or what ever else you
>may call them are not to be used for a wave soldering process.
>
>John Shaub CID
>Honeywell IS
>Fort Washington, PA
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