FreeLists / pcdlist / [pcdlist] Re: Thru hole components

[Ron Olinyk <rolinyk@xxxxxxxxxxxxx>]

I've heard of this being done before but how well does it work? Is there 
enough solder flow available to form a proper fillet? As unconventional as 
it may sound, it could save assembly $. Any info on it's reliability or an 
IPC spec?
Ron Olinyk, CID

At 04:56 AM 5/10/02 -0700, you wrote:

>Lots of good points made here regarding combined hole sizes.
>The only thing I have not seen mentioned is how it would effect a combined
>soldering process. I have been requested by our internal manufacturing guys
>(now it's external) to define hole sizes that would allow the through hole
>components to be soldered at the same time the SMT parts are. They requested
>that any through hole components maintain their sizes in the .006 to .010
>over lead dia.
>This would allow solder paste to be screened into the holes at the same time
>it is applied to the SMT pads. Woolaaa......... both component types, one
>process. These foot print, pad stack, geometry, parts or what ever else you
>may call them are not to be used for a wave soldering process.
>
>John Shaub CID
>Honeywell IS
>Fort Washington, PA
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