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[pcdlist] Re: Thru hole components
- From: john.shaub@xxxxxxxxxxxxx
- To: pcdlist@xxxxxxxxxxxxx
- Date: Fri, 10 May 2002 04:56:53 -0700
Lots of good points made here regarding combined hole sizes.
The only thing I have not seen mentioned is how it would effect a combined
soldering process. I have been requested by our internal manufacturing guys
(now it's external) to define hole sizes that would allow the through hole
components to be soldered at the same time the SMT parts are. They requested
that any through hole components maintain their sizes in the .006 to .010
over lead dia.
This would allow solder paste to be screened into the holes at the same time
it is applied to the SMT pads. Woolaaa......... both component types, one
process. These foot print, pad stack, geometry, parts or what ever else you
may call them are not to be used for a wave soldering process.
John Shaub CID
Honeywell IS
Fort Washington, PA
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