FreeLists / si-list / [SI-LIST] Re: Why is capacitor with high ESR

[steve weir <weirsp@xxxxxxxxxx>]

Chrsi no problem, we'll take care of that noise with single points and 
splits!  Seriously, if you would like to do a test vehicle out of academic 
interest, I think you will find that DET does a better job suppressing EMI 
than a highly reflective fence.

Regards,


Steve
At 10:48 AM 12/6/2004 -0800, Chris Cheng wrote:
>The reality will be the top/bottom layers will have microstrip signals added
>(8 layers) which will force me to use ground plane reference and arrangement
>like 6) with outer signal layers added will unlikely to happen in my design.
>If you have microstrip signals and construct it with power as reference
>plane at the bottom as in 6). You are in for more trouble than edge
>radiation.
>
>-----Original Message-----
>From: steve weir
>To: Chris Cheng; Chris Cheng; ''sguzek@xxxxxxxxx ' '; ''Si-List ' '
>Sent: 12/6/2004 10:38 AM
>Subject: RE: [SI-LIST] Re: Why is capacitor with high ESR
>
>Chris, I agree that 7 will work better than 5, although it might be a
>little bit less representative of what people actually build.
>
>Where we disagree is whether 7 will actually be better than 6.  I don't
>think it will for the reasons stated.  Do you think you can convince
>your
>company to build two test boards, one as 7 and one as 6?  The
>alternative
>is to run models, assuming we want to trust them.
>
>Regards,
>
>
>Steve
>
>
>At 10:12 AM 12/6/2004 -0800, Chris Cheng wrote:
> >Steve,
> >I would think
> >
> >7)
> >Gnd
> >Power
> >Signal
> >Signal
> >Gnd
> >Gnd
> >
> >with the fence and sea of vias and decoupling in between will be better
>than
> >6)
> >
> >For 4) it is obvious there is no edge containment.
> >For 5) while the edge containment can help the first five layers, the
>bottom
> >power plane can still have noise current which solely relie on
>decoupling
> >caps that may or may not be effective and you will need a case like 6)
>to
> >ensure the complete edge containment (since you can short the gnd/power
> >planes with vias).
> >
> >-----Original Message-----
> >From: steve weir
> >To: Chris Cheng; 'sguzek@xxxxxxxxx '; 'Si-List '
> >Sent: 12/5/2004 11:30 PM
> >Subject: RE: [SI-LIST] Re: Why is capacitor with high ESR
> >
> >Chris,
> >
> >No, I don't see a lot of value from the very low R's in existing
> >caps.  Yes, lots of ground vias do divide the cavities up and cause a
> >lot
> >of scattering.  Unfortunately, even a good number of those vias rise to
> >the
> >surface to meet decoupling caps which then become a source of
> >radiation.  This is not to mention the other signal vias that do the
> >same
> >thing.
> >
> >We could have some fun constructing some ML boards with a stackup
>having
> >at
> >least two ground planes one close to each end of the stack-up that
> >allows
> >for a fence.  We could add more layers, but I think the following 6
> >layer
> >is adequate for the thought-problem / experiment:
> >
> >Gnd
> >Power
> >Signal
> >Signal
> >Gnd
> >Power
> >
> >1.  Oscillator with nice fast CMOS drivers in the middle as our noise
> >source, aside from local decoupling in the middle of the board, it will
> >be
> >an open cavity.
> >2.  Same as 1. but with ground fence only at the board edges.
> >3.  Same as 1. but with fence using DET with the best dissipative caps
> >that
> >we can get.
> >4.  Same as 1, but with lots of ground  and power vias distributed
> >around
> >the board many connecting to decoupling caps on the surface.
> >5.  Save as 4, but with fence as in 2.
> >6.  Same as 4, but with DET as in 3.
> >
> >I believe that we agree that between 1, 2, and 3, that 3 will have the
> >lowest radiation.
> >I believe that we agree that between 1 and 4, 2 and 5, and 3 and 6,
> >4/5/6
> >will have lower radiation than 1/2/3 respectively.
> >
> >What I think you will find interesting is that of 4, 5, and 6, that 6
> >offers considerable improvement over both 4 and 5.  This has been the
> >subject of much of Istvan's work on the benefits of DET.  The impinging
> >energy only hits the vias once on its way out to the board edge where
>it
> >is
> >absorbed.  The "ice-cube trays" of 4. help to remove a lot of the
> >coherency
> >from the noise, but we are pretty much stuck with the dielectric losses
> >to
> >dump the HF energy into heat.  What does not become heat escapes on its
> >way
> >to Zontar.
> >
> >I hope that we can agree that an alternative demonstration is to break
> >up
> >the Vcc plane into sections that are tied together with lossy
>decoupling
> >
> >networks.  Would you be surprised to find that the EMC performance of
> >such
> >a board with a thick cavity is much better than the same geometry board
> >where the Vcc has not been divided, sic 1, or 4 from above?
> >
> >Regards,
> >
> >
> >Steve.
> >
> >
> >At 10:41 PM 12/5/2004 -0800, Chris Cheng wrote:


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