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[SI-LIST] SPICE or IBIS

  • From: "package_char" <emc_gibney@xxxxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Wed, 03 Dec 2003 10:02:01 -0000
Experts,

I have been researching some methods to model packages and connectors 
and from what I have seen a common method is to extract a coupled 
lumped/distributed SPICE model from VNA or TDR/T measurements. These 
SPICE models can be used to model performance at high 
speed/frequencies. My question is if I was to create an IBIS model as 
oppposed to a SPICE model is there any limitations, for example? 

a) the highest frequency/shortest rise time possible
b) how does it handle losses etc

As I understand there is software to convert a SPICE model to IBIS 
format, would this be the best way to go or directly create an IBIS 
model from measurements? 

Regards,

Eoin Mc Gibney
CIT
emcgibney@xxxxxx

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