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[SI-LIST] SPICE or IBIS
- From: "package_char" <emc_gibney@xxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 03 Dec 2003 10:02:01 -0000
Experts,
I have been researching some methods to model packages and connectors
and from what I have seen a common method is to extract a coupled
lumped/distributed SPICE model from VNA or TDR/T measurements. These
SPICE models can be used to model performance at high
speed/frequencies. My question is if I was to create an IBIS model as
oppposed to a SPICE model is there any limitations, for example?
a) the highest frequency/shortest rise time possible
b) how does it handle losses etc
As I understand there is software to convert a SPICE model to IBIS
format, would this be the best way to go or directly create an IBIS
model from measurements?
Regards,
Eoin Mc Gibney
CIT
emcgibney@xxxxxx
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