FreeLists / si-list / [SI-LIST] DDR propagation delay and packaging

[Perry Qu <perry.qu@xxxxxxxxxxx>]

Hi, everyone:

I'm doing SI work on a 200 MHz DDR interface. To measure propagation, we
used the traditional method, i.e., simulate driver with reference load
and simulate driver with real load. Measure time difference from Vmeas
at reference load to Vref (+/- certain noise) at receiver.

Now the question I had: the controller is a big ASIC with maximum delay
on packaging itself around 140 ps. Since all timing are defined at pin,
I have to use the waveform at pin to measure delay. In the case of
memory write to controller, waveform at pin can get distorted due to
packaging. I get shelf/ledge on the edge. I use the following two
approach to measure delay and get very different results (more than
100ps):

1. use waveform at packaging pin to measure delay;
2. use waveform at chip pad to measure delay and substracted the ASIC
packaging delay to get the delay at pin;

ASIC vendor suggest approach 1 but I don't feel quite comfortable.
Wonder how all you experts are dealing with this issue ?

Thanks

Perry

--
Perry Qu

Design & Qualification       |      600 March Road
Alcatel Canada               |      Ottawa, ON K2K 2E6, Canada

DID: (613) 7846720           |      FAX: (613) 5993642


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