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[SI-LIST] Re: PCI-X Specification!

  • From: Weber Chuang <WeberChuang@xxxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Thu, 6 Dec 2001 14:31:34 +0800
Just for discussion and please correct me if I am wrong: I would assume =
that
the Cin includes Ccomp  capacitance(die, transistors..) and package
capacitance(bond wire, bond finger...BGA balls). Because I think Cin =
means
the capacitance when looks into the package pin from outside of the =
chip,
also when we measure the Cin with TDR and TDA software, the measured =
values
complies with the Cin spec of that chip, and the load we measure is =
from
package pin into chip die. This would at least partially reconfirms my
thought.

  Best Regards=20
    Weber Chuang( =B2=F8=B4=BA=B2e)
 Signal & Timing Integrity Engineer,
 VIA Technologies, Inc.  Taipei, Taiwan, ROC=20
 TEL : 886-2-22185452  ext : 6522
 mailto:weber@xxxxxxxxxx
 http://www.via.com.tw
 Very Innovative Architecture


-----Original Message-----
From: Muranyi, Arpad [mailto:arpad.muranyi@xxxxxxxxx]
Sent: Thursday, December 06, 2001 3:03 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: PCI-X Specification!



I can't answer your question on what Cin in the
PCI-X spec means, but I want to respond to your
second question.

C_comp in IBIS means die capacitance as seen when
you look into the die at the pad.  That includes
pad capacitance, metal capacitance, and buffer
(transistor) capacitance.  It doe NOT include
anything that comes from the package, which is
modeled in a different section in the IBIS file.

Arpad Muranyi
Intel Corporation
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=


-----Original Message-----
From: Tariq Abou-Jeyab [mailto:aboujeyab@xxxxxxxxx]
Sent: Wednesday, December 05, 2001 10:18 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] PCI-X Specification!



Hi everyone,

I have couple of questions regarding PCI-X spec.:

1) Does Cin (input pin capacitance) includes die
capacitance? and if the answer is yes, what value
would we specifiy for Cpin and Ccomp in ibis?

2) What is the +overshoot and -overshoot number? I'm
asking about the transient numbers not the dc level.

Thanks for your help,

Regards,

Tariq Abou-Jeyab

__________________________________________________
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