FreeLists / si-list / [SI-LIST] Re: How to measure package impedance or characteristic for a chip?

["Isaac Kantorovich" <kantor@xxxxxxx>]

Quyen,

We do not know yet when the presentation will be on-line. However, it will
be published in Proceedings of 11th EPEP, so you may get it through IEEE,

Regards,

Isaac

----- Original Message -----
From: "Quyen Vu" <Quyen.Vu@xxxxxxx>
To: <kantor@xxxxxxx>
Cc: <si-list@xxxxxxxxxxxxx>
Sent: Monday, October 07, 2002 5:07 PM
Subject: [SI-LIST] Re: How to measure package impedance or characteristic
for a chip?


>
>
>
> Hi Isaac,
>
> Can we access the presentation on line? if so, when could we access it?
>
> Thanks,
>
> qv
>
> > Delivered-To: si-list@xxxxxxxxxxxxx
> > From: "Isaac Kantorovich" <kantor@xxxxxxx>
> > To: <John@xxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
> > Subject: [SI-LIST] Re: How to measure package impedance or
characteristic=
>  for=20
> a chip?
> > Date: Sat, 5 Oct 2002 12:45:07 -0400
> > Content-Transfer-Encoding: 8bit
> > X-Priority: 3
> > X-MSMail-Priority: Normal
> > X-MIMEOLE: Produced By Microsoft MimeOLE V6.00.2600.0000
> > X-archive-position: 4199
> > X-ecartis-version: Ecartis v1.0.0
> > X-original-sender: kantor@xxxxxxx
> > X-list: si-list
> >=20
> >=20
> > John,
> >=20
> > Our presentation on 11th EPEP conference in Monterey, CA, may be of
inter=
> est
> > to you. It suggests a method of on-chip impedance measurement under
compu=
> ter
> > operating conditions (die and package are not separated), which can
allow
> > you to measure milliohms and fractions of milliohms of impedance at
large
> > frequency range.
> >=20
> > The presentation will be on Wednesday, October 23, from 8.30 to 9.50 am.
=
> The
> > title is:
> >=20
> > "Measurement of milliohms of impedance at hundred MHz on Chip Power
Suppl=
> y
> > Loop," Isaac Kantorovich, Chris Houghton, Steve Root and Jim St.
Laurent,
> > Hewlett-Packard, USA
> >=20
> > Regards,
> >=20
> > Isaac Kantorovich,
> > HP Corporation
> >=20
> >=20
> > ----- Original Message -----
> > From: "John Lin (=AAL=B4=C2=B7=D7)" <John@xxxxxxxxxxxx>
> > To: <si-list@xxxxxxxxxxxxx>
> > Cc: "John Lin (=AAL=B4=C2=B7=D7)" <John@xxxxxxxxxxxx>
> > Sent: Thursday, October 03, 2002 9:23 PM
> > Subject: [SI-LIST] How to measure package impedance or characteristic
for=
>  a
> > chip?
> >=20
> >=20
> > > Dear all SI gurus,
> > > Can somebody help to provide me a way to measure chip package
impedance
> > without separating die and package?
> > > Can a TDR be used to do so?  Or what instruments, such as VNA,  to do
s=
> o?
> > >  Do I need to make a fixture on PCB to measure it?
> > >
> > > Thank you for your helps in advance :-)
> > >
> > > John Lin
> > >
> > > Quanta Computer Inc.,Taiwan, R.O.C.
> > > Email: John@xxxxxxxxxxxx
> > > Tel: 886+3+3272345 ext. 5183
> > >
> > >
> > >
> > >
> > >
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