FreeLists / si-list / [SI-LIST] Split Power Planes

[sunil bharadwaz <sunil_bharadwaz@xxxxxxxxx>]

Hi Experts ,
While doing our Mixed Signal boards , our practice is to split both the
Power & Gnd planes into Analog & Digital sections.Both the planes
are again joined at a single point thru narrow traces.


The plan is to follow the same principal for the package design
of a mixed signal SOC.However,there is one school of thought
 which say's the split in the ground plane can be joined thru a
 narrow trace on the package substrate , where as the split in the 
power(VCC) plane could be left with out joining at the package
 level & the join could be done on the final board.

(Of course IR drop in this case is not an issue).

Appreciate any kind of feed back on this.

regards
Sunil.b

       
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