FreeLists / si-list / [SI-LIST] Mixed Signal Design Tools Workshop at Georgia Tech

["Ege Engin" <engin@xxxxxxxxxxxxxx>]

Hello All,

A final agenda is now available for this workshop:
 
http://www.prc.gatech.edu/events/2005/digital/

The workshop is on this Friday, September 16, at Georgia Tech. Registration
is free and will continue until Opening Remarks on the day of the event.

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MIXED SIGNAL DESIGN TOOLS IN ADVANCED PACKAGING
An Industry-Academia Consortium Workshop
Friday, September 16, 2005

Georgia Institute of Technology, Manufacturing Research Center (MaRC)
Building, Atlanta, GA  U.S.A.
Map and Directions: http://www.prc.gatech.edu/welcome/directions.htm

Organizers: Profs. Madhavan Swaminathan, Prof. Rao Tummala & Dr. Ege Engin
(Georgia Institute of Technology)

ONLINE REGISTRATION, AGENDA, ACCOMMODATIONS & INFO:
http://www.prc.gatech.edu/events/2005/digital/index.htm
There is no charge for this event. Participants are invited to attend the
PRC Open House on Sept. 19, 2005.

ABSTRACT
A major bottleneck in the development of next generation packaging
technologies is the design tools. Due to the integration of heterogeneous
functions in a package, mixed signal design tools are necessary that are
part of a design flow. The Packaging Research Center (PRC) at Georgia
Institute of Technology has been one of the pioneers in this area,
introducing tools that address the System-on-Package (SOP) technologies.
Design of such highly integrated mixed-signal systems require new tools
that, for example, take into consideration the increased interaction between
the IC and package leading to system miniaturization. This workshop is
targeted to discuss the electrical issues arising in mixed signal design,
leading to the development of mixed-signal design tools through the
formation of a consortium of companies at PRC, which can provide solutions
in this area.

The morning session of the workshop will include presentations by
participants from industry and the academia. The afternoon session will
include a discussion on the formation of the consortia and consortia topics.
The attendees from industry will include participants that represent EDA
companies, system companies and semiconductor companies.

TOPICS
. Design Flow 
. Electrical Chip-Package Co-Design 
. Signal and Power Integrity 
. Design Tools for RF Packaging 
. Electromagnetic Analysis 
. Circuit Analysis Methods 
. Design for Manufacturing 
. Physical Design

INDUSTRY PARTICIPANTS
IBM, CISCO, LSI Logic, Altera, Infineon, Panasonic, Broadcom, Ansoft,
Dupont, Optimal, NGK, Zeland

ACADEMIA PARTICIPANTS
Georgia Tech, University of Illinois, North Carolina State University,
Politecnico di Torino, Carleton University

GEORGIA TECH FACULTY & RESEARCH PARTICIPANTS
Prof. Madhavan Swaminathan
Prof. Rao Tummala
Prof. Manos Tentzeris
Dr. Ege Engin

ONLINE REGISTRATION, AGENDA, ACCOMMODATIONS & INFO:
http://www.prc.gatech.edu/events/2005/digital/index.htm


Contact Info
Prof. Rao Tummala rao.tummala@xxxxxxxxxxxxx, 404-894-9097
Prof. Madhavan Swaminathan madhavan.swaminathan@xxxxxxxxxxxxxx, 404-894-3405
Dr. Ege Engin engin@xxxxxxxxxxxxxx, 404-385-7042



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