FreeLists / si-list / [SI-LIST] Re: Board Layer Material Comparison

[Scott McMorrow <scott@xxxxxxxxxxxxx>]

Rick

the N4000-13 SI material will provide several benefits based on it's 
lower Er and lower Er of the SI-glass.

1) Reduced overall pcb thickness
2) Reduced local Er variation due to laminate fiberglass weave.
3) Increased power/ground plane resonant frequency, which extends the 
useful range of operation of thin power/ground laminates.
4) Wider, lower-loss, traces for a given dielectric thickness.
5) Thinner dielectrics for equivalent trace width.

The downside

1) SI material is more expensive by about 20%
2) SI material is more costly to process, due to higher drill wear.
3) No advantage in dielectric loss over N4000-13 material.
4) Limited material laminate weaves available.



Baze, Rick wrote:

>A 30-layer board we are in process of designing is under discussion of 
>materials to use and their related advantages and disadvantages.  
> 
>The current design has the top 8 layers using N4000-13 for signal/gnd, the 
>next 12 layers using GETEK for power/gnd, and the bottom 10 layers again using 
>N4000-13 for signal/gnd.
> 
>The proposed design is all N4000-13 SI.  
> 
>The debate is what advantages/disadvantages there are between the two designs 
>besides the original design requiring longer, more expensive processing.
> 
>Feedback is greatly appreciated.
> 
>Best Regards,
>Rick
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Scott McMorrow
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