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[SI-LIST] Cable grounding scheme
- From: chen_jinhua@xxxxxxx
- To: <si-list@xxxxxxxxxxxxx>
- Date: Mon, 14 Aug 2006 16:49:34 -0400
Hi,
I have a few general questions about the high speed cable grounding
scheme. It could impact both SI and EMI. I would like to have your
inputs about this issue.
Scheme 1: cable does not separate logic ground and chassis ground. But
when it connects the system/boards, the system/boards have separate
logic ground and chassis ground. How do you separate/connect the logic
ground to chassis ground in boards? What is the pros and cons for SI
and/or EMI?=20
Scheme 2: Cable keeps separate logic ground and chassis ground.
System/boards also keep the separate logic and chassis ground. Cable
logic ground and board logic ground connects, and chassis connects the
chassis ground. How do you separate/connect the logic ground to chassis
ground in boards? What is the pros and cons for SI and/or EMI?
Do you prefer scheme 1 or scheme 2? What is the pros and cons of scheme
1 vs. scheme 2 for SI and/or EMI? Does SI and EMI have conflict
requirements?
Thanks!
Jinhua Chen
SI of Hardware Engineering
EMC Corp.
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