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[SI-LIST] R: Wire bonding
- From: <gianguida@xxxxxxxx>
- To: <dan1_st@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 8 Aug 2006 08:45:24 +0200
Hi David,
I believe the effect of the wirebond cannot be neglected.
It is possible to find some formula to calculate
lumped model for the wire but considering your actual design and
possible future development
I would suggest to use a 3D field solver such as CST Microwave Studio or others
available in the market.
Hope this helps
Giancarlo
-----Messaggio originale-----
Da: si-list-bounce@xxxxxxxxxxxxx per conto di david stern
Inviato: lun 07/08/2006 23.22
A: si-list@xxxxxxxxxxxxx
Oggetto: [SI-LIST] Wire bonding
HI
We are designing an electro-optical element for
infiniband optical transceiver.
We are using a driver as a dye chip with wire bonding
process.
The 1 mil wire is 1mm long. One side of the dye chip
is using 2 wires for differential input
and on the other side we use 1 wire surrounded with 2
GND wires for signal.
Our devices are design to work at baud rate of 5Gbps.
I tried to get information on the web about signal
integrity for high speed wire bond without any
success.
1. Where can I find material about SI for wire
bonding?
2. how shall I define wire bond in simulation? shall
I defied it as inductor?
3. How shall I calculate the impedance of the wire
bonding?
4. Are there cases were wire bond can be neglect due
to the fact that it place right after the driver or
right before the receiver?
Thanks in advance
David
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