FreeLists / si-list / [SI-LIST] New Packaging SI Opportunity ...

["Neeraj Pendse" <cnepsc@xxxxxxxxxxx>]

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This employment opportunity is being directly advertised by the employer.
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National's Package Technology Group has an immediate opening for an 
interconnect electrical performance / signal integrity engineer 
focussing on IC packaging for the next generation of analog and mixed 
signal products.

National Semiconductor is the leading analog company driving the 
information age.  Combining real world analog and state-of-the-art 
digital technology, the company is focused on analog-based semiconductor 
products, which include stand-alone devices and subsystems in the areas 
of power management, portable power, display drivers, audio, amplifiers 
and data conversion.  With headquarters in Santa Clara, National 
reported sales of $1.98 billion for its most recent fiscal year.

Job Title:
Packaging Engineer -  Electrical Performance
Package Technology Group, National Semiconductor Corp.

Job Description:

As an engineer in this position, you will be responsible for 
characterizing electrical performance of packages, advising product 
teams on package selection and pushing the envelope on speed and noise 
immunity on existing packaging technologies.

Key Responsibilities include:
Provide electrical modeling/ characterization support as part of 
National's advanced package technology group. Coordinate activities 
between modeling, circuit design teams and application engineering to 
provide an electrically robust packaging solution to National's IC 
products. Own and update the package electrical performance roadmap for 
Package Technology Group.

Define methodologies for electrical performance modeling, and 
communicate these methodologies to design teams across the corporation 
as needed. Be a part of the research and development of future packaging 
technologies for National's focus on high performance analog ICs.

Requirements:
MS in Electrical Engineering, with a packaging focus. Candidates with MS 
in Mechanical / Material Science Engineering having sufficient 
background in Electrical Engineering will also be considered. Two to 
three years of experience in evaluating electrical performance of 
packages using simulations and measurements.

Experience with RLC extraction / electromagnetic simulation tools, for 
example Ansoft HFSS, Sigrity SPEED, Q3D Extractor, and Agilent ADS. A 
background in high frequency design and microwave engineering will be a 
big plus.

An ideal candidate will be proactive, curious, innovative, with strong 
communication skills and able to take projects to completion with 
minimal supervision.

Interested parties should contact Rudy Ramos in Global Staffing Group 
directly (rudy.r.ramos@xxxxxxx), please feel free to keep me copied 
(neeraj.pendse@xxxxxxx)

Regards,


- Neeraj Pendse.

Senior Packaging Engineer
BGA and Electrical Performance
National Semiconductor Corp


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