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[SI-LIST] Re: High performance materials

  • From: "Chris Robertson" <Chris.Robertson@xxxxxxxxxxxxx>
  • To: <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 10 Jul 2001 13:29:45 -0500
Chris,

I just had a long talk about that with Mary Sugden of the
"Copper connection" (I love that woman)

Assembly and application.
The items you ask yourself.
Do I have Hi frequency concerns? (concerning Er)
Do I have a large number of auto assembly items? (concerning heat and Tg)
Are there a lot of large lead (requires higher heat) items?
Are there material flexibility issues?

Just relaying something I've recently learned about the Tg or
heat breakdown. It is cumulative! I had the understanding that
the material is fine as long as the heat applied didn't come
close to the Tg value of the board. Wrong.....

Each heating process takes a toll on the material.
Is there a formula for figuring this? ( I wish)

Don't know if I answered or made more questions.

Chris Robertson
Chris.Robertson@xxxxxxxxxxxxx








>
>
> Does anyone know of any studies detailing justification for using high
> performance PCB materials on boards other than back planes?   I am
> concerned with thermal stability and group delay issues with using FR4
> on boards implementing data rates up to and beyond 2 Gb/s.
>
> Regards,
> --
>  Chris Mesibov
>  Sr. Hardware Engineer Fujitsu Network Communications, Inc.
>  Phone:(845)731-2037   2 Blue Hill Plaza, 6th Floor
>  Fax:  (845)731-2011   Pearl River, NY 10965
>
>
>
>
>
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