FreeLists / si-list / [SI-LIST] Re: soldering plastic balls

[steve weir <weirsi@xxxxxxxxxx>]

Jose look into what W.L. Gore has.  Samtec ( disclaimer I have an 
affiliation ) also demonstrated long active equalized cables at 
DesignCon 2007.

Good luck.


Steve.

Moreira, Jose wrote:
> Orin, Steve
>
> On the topic of outer layer conductor for HF equalization, do you know of any 
> cable assembly manufacturers having already on their portfolio this type of 
> conductors available for ordering? 
>
> I have read about them but I have not seen this type of conductors being used 
> even on application requiring long coaxial cables for high-speed digital 
> applications. I'm wondering why?
>
>
> Jose
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On 
> Behalf Of olaney@xxxxxxxx
> Sent: Dienstag, 5. Juni 2007 21:10
> To: weirsi@xxxxxxxxxx
> Cc: write2larsj@xxxxxxxxx; dan1_st@xxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: soldering plastic balls
>
> That's the same theory that works for copperweld coax conductors (copper
> plated steel).  At HF the signal sees only the copper plating, at LF the
> resistance does not drop as much from the HF value, ...and it's cheaper!
>
> Orin
>
> On Tue, 05 Jun 2007 11:57:51 -0700 steve weir <weirsi@xxxxxxxxxx> writes:
>   
>> Lars, the technique of using only an outer layer conductor for HF 
>> equalization is well established.  There is a nifty interposer 
>> connector 
>> technology that uses tiny silver plated nickel balls.
>>
>> Regards,
>>
>>
>> Steve.
>> Lars Juul wrote:
>>     
>>> Hi Steve,
>>>
>>> I'm surprised to hear that the primary objective with the plastic 
>>>       
>> core 
>>     
>>> balls is to equalize the resistance over frequency, as Sekisui 
>>>       
>> write 
>>     
>>> on their product page:
>>>
>>> ( http://www.sekisui-fc.com/eng/html/jissou/product/jipr_02.html)
>>> ...
>>> Micropearl SOL is a solder plated true sphere with a plastic core 
>>>       
>> and 
>>     
>>> was designed for mounting chips to circuit board. Unlike 
>>>       
>> conventional 
>>     
>>> solder balls which often cracks under the heat cycle test,
>>> ...
>>>
>>> They go on to show graphs with how much longer these solderjoints 
>>>       
>> will 
>>     
>>> hold in temp cycle tests comparison to SnAg alloys, which I feel 
>>>       
>> is 
>>     
>>> very relevant in these RoHS times.
>>>
>>> However, it's true that at high frequencies the current flows on 
>>>       
>> the 
>>     
>>> edge of the conductor (in closest possible proximity to your 
>>>       
>> return 
>>     
>>> current), and that the lack of conductor diameter will lead to 
>>> increased resistance closer to low frequencies, but I doubt that 
>>>       
>> it 
>>     
>>> will act as a good loss equalizer (I might be wrong, I guess)
>>>
>>>
>>> 2007/6/5, steve weir <weirsi@xxxxxxxxxx 
>>>       
>> <mailto:weirsi@xxxxxxxxxx>>:
>>     
>>>     Lars, the idea of the plastic balls is that they have only  a 
>>>       
>> thin
>>     
>>>     outer
>>>     conducting layer and therefore the resistance remains much 
>>>       
>> more
>>     
>>>     uniform
>>>     and therefore equalizing loss across a broad frequency range.
>>>
>>>     Steve.
>>>     Lars Juul wrote:
>>>     > Hi David,
>>>     > I would call up your packaging vendor and ask them to make a
>>>     test build with
>>>     > ball samples from Sekisui on existing 10 Gbps BGAs, provided 
>>>       
>> the
>>     
>>>     ball attach
>>>     > tool is suitable for this. This is usually the stumbling 
>>>       
>> block,
>>     
>>>     as this is
>>>     > very expensive in NRE.
>>>     >
>>>     > Alternatively, it's worth exploring if you make a manual 
>>>       
>> ball attach
>>     
>>>     > (possible if the packages are for small form factor 10Gbps 
>>>       
>> CDRs, for
>>     
>>>     > instance) by printing solder paste on the package lands 
>>>       
>> first,
>>     
>>>     and then
>>>     > manually place the balls  on the paste by a trained person 
>>>       
>> with
>>     
>>>     a steady
>>>     > hand. I assure you, crazier things have been made.
>>>     >
>>>     > On the other hand, my only concern with this kind of balls 
>>>       
>> would
>>     
>>>     be the
>>>     > suitability for them in the power supply, as I imagine the
>>>     current carrying
>>>     > capabilities are somewhat limited if you have a plastc core 
>>>       
>> on
>>     
>>>     the inside.
>>>     > (I don't think it's possible to attach solid solder and 
>>>       
>> plastic
>>     
>>>     balls on
>>>     > specific lands on the package in a high volume setup, yet)
>>>     >
>>>     > PS: you're asking whether they work at 10GHz, which is a 
>>>       
>> single
>>     
>>>     frequency
>>>     > point, I think it's feasible to use plastic core balls for a
>>>     narrowband
>>>     > application, but if it's broadband from 0 to 10e9 Hz you're
>>>     driving at, I'd
>>>     > say, try it out in practise first to see if it flies, then 
>>>       
>> make
>>     
>>>     a full wave
>>>     > or macromodel of package afterwards to feed the chip I/O 
>>>       
>> designers.
>>     
>>>     >
>>>     > Have fun.
>>>     >
>>>     > Best regards,
>>>     > Lars
>>>     >
>>>     > 2007/6/5, david stern <dan1_st@xxxxxxxxx
>>>     <mailto:dan1_st@xxxxxxxxx>>:
>>>     >
>>>     >> hello all
>>>     >>
>>>     >>   I was looking for bga soldering balls  technology for an
>>>     >> application working at 5GHz to 10GHZ and  and found
>>>     >> soldering plastic balls from SEKISUI. Did somebody work 
>>>       
>> with
>>     
>>>     them at
>>>     >> 10Ghz?
>>>     >>
>>>     >>   Thanks
>>>     >>
>>>     >>   David
>>>     >>
>>>     >>
>>>     >> ---------------------------------
>>>     >> Moody friends. Drama queens. Your life? Nope! - their life,
>>>     your story.
>>>     >> Play Sims Stories at Yahoo! Games.
>>>     >>
>>>     >> 
>>>       
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