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[SI-LIST] EPEP'2001 reminder for July 10, 2001 deadline

From: "Alina Deutsch" <deutsch@xxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx, epd@xxxxxxxxxxxxxxxx,prince@xxxxxxxxxxxxxxx, "George Katopis" <katopis@xxxxxxxxxx>
Date: Mon, 11 Jun 2001 08:55:18 -0400

Dear Subscribers,
This is a reminder that the deadline for paper submission to EPEP'2001
conference is fast approaching.
Please check all the details at www.epep.org.
The dealine for submitting your paper is July 10, 2001.
The following topics are welcomed:
   Package analysis, including numerical methods and algorithms
   Electro-magnetic analysis tools
   Advances in transmission-line techniques
   Power distribution and package resonance
   Switching noise in multi-layered structures
   Impact of OE/EO transducers on performance of module-level and
   inter-module interconnects
   RF/microwave packaging structrues and their electrical performance
   Multilayer LTCC packaging for microwave applications
   MMIC modules and high density packaging
   Experimental characterization techniques and testing procedures
   EMC/EMI sources and effects
   Prediction and measurement of radiation from on-chip sources,
   interconnect structures and package systems
   Long distance propagation in large swiatching complexes
   Electrical issues in MEMS packaging
   New and innovative interconnect packaging structrues and their
   electrical performance
   Electrical design implications for low cost, high volume packaging
   Packaging concerns for wireless communication: design and modeling
   Performance of low cost packaging solutions for communication systems
   Performance of packaging for automotive radar systems
   Optoelectronic packaging: structure and system applications
   Current and future issues related to on-chip interconnections
   Router friendly models and modeling tools: accuracy and efficiency
   Modeling and design of high speed digital I/O circuits: signal
   propagation and reception
   On-chip power delivery and regulation
   Advances in modeling core switching noise, and design of novel solutions
   On-chip measurement techniques.

Regards,
  Alina

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