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[SI-LIST] Re: Cross-hatched reference planes
- From: "Chris Cheng" <Chris.Cheng@xxxxxxxx>
- To: "Ray Anderson" <ray.anderson@xxxxxxxxxx>
- Date: Thu, 5 Apr 2007 14:45:59 -0700
Now that's a first to me. We are talking about the build up, not the core
layers here, aren't we ?
Thanks for the heads up.
-----Original Message-----
From: Ray Anderson [mailto:ray.anderson@xxxxxxxxxx]
Sent: Thursday, April 05, 2007 1:13 PM
To: Chris Cheng
Cc: si-list@xxxxxxxxxxxxx; Ray Anderson
Subject: Re: Cross-hatched reference planes
Chris Cheng wrote:
"I thought they are called degassing holes. I have yet to see a build up
multi-layer package that doesn't need one."
Chris-
Don't know about all package vendors, but Kinsus requires the degassing holes
in laminate package designs they fabricate whereas Fujitsu's process doesn't
need them.
-Ray
Raymond Anderson
Senior Signal Integrity Staff Engineer
Advanced Platforms Group
Advanced Products Division
Product Technology Department
Package Design Engineering
Xilinx Inc.
2100 Logic Drive
San Jose, California 95124
(408) 626-6277
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