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[SI-LIST] Re: Antwort: Re: Questions about interplane capacitance
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: Chris Cheng <Chris.Cheng@xxxxxxxx>
- Date: Sat, 15 Mar 2008 11:10:53 -0400
Chris
Now tell the memory, processor and chipset vendors that and get their
buy-in to switch from Single Ended to Differential data lines.
Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax
http://www.teraspeed.com
Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC
Chris Cheng wrote:
> There is a very cost effective way to eliminate signal induced plane
> resonance.
> It is call differential signal. Differential mode is orders of magnitude
> smaller vs. common mode noise injection into planes.
>
> ________________________________
>
> From: istvan novak [mailto:Istvan.Novak@xxxxxxx]
> Sent: Fri 3/14/2008 7:31 PM
> To: Chris Cheng
> Cc: steve weir; Joel Brown; SILR; Istvan Novak; si-list@xxxxxxxxxxxxx
> Subject: Re: [SI-LIST] Re: Antwort: Re: Questions about interplane capacitance
>
>
>
>
> Chris,
>
> This seems to be one of those topics, which are governed by beliefs and
> it is hard to convince each other.
>
> The important thing is that people understand the physics behind the
> circuit and the way how various options can be used to solve the task.
> From that point on it is the designer's responsibility to weigh the
> constraints and the options and to come up with a working design.
>
> Regarding plane resonances, you are correct in saying that if you do not
> excite them, they make no harm. However, if there is a cost-effective
> way to eliminate them, I rather choose to eliminate the resonances
> rather than worrying that they dont get excited.
>
> Regards,
> Istvan
>
>
> Chris Cheng wrote:
>
>
>> Ok, now we eliminate the claim that core power distribution needs fancy PCB
>> planes and decoupling solutions at the PCB level.
>> As you say if the core plane is used as reference planes, what controls your
>> plane capacitance/loop inductance ? The impedance control for the stripline
>> that they sandwich or your fancy power plane scheme ?
>> This whole plane resonance also borders me. A few months ago we have already
>> have long discussion here about a CAD tool vendor and another company's
>> paper claiming plane resonances in simulation and measurement. As I have
>> pointed out then and I will repeat again now, that was just a matter of via
>> placement for signal return rather than real plane resonance. Both the
>> measure and simulation conditions were set at an unrealistic condition to
>> scare people into thinking there is a plane resonance problem. I have always
>> maintain signal return issue on PCB is a matter of proper reference plane
>> and return via placement, NOT fancy decoupling. If you shoot yourself in the
>> foot and then run around claiming you need a fancy stretcher, I really have
>> nothing more to add.
>>
>> -----Original Message-----
>> From: Istvan.Novak@xxxxxxx [mailto:Istvan.Novak@xxxxxxx]
>> Sent: Friday, March 14, 2008 6:31 PM
>> To: Chris Cheng
>> Cc: steve weir; Joel Brown; SILR; Istvan Novak; si-list@xxxxxxxxxxxxx
>> Subject: Re: [SI-LIST] Re: Antwort: Re: Questions about interplane
>> capacitance
>>
>>
>>
>> Chris,
>>
>> You are right; if we speak about a single point-of-load CPU core power
>> distribution, we *may* not need to worry about high-frequency behavior
>> on the board. However, as always, it depends. IF your power rail feeds
>> only the particular CPU core, AND you do not use those planes as signal
>> reference, AND if you do not need to go through this plane cavity with
>> vias of sensitive signals, all you need is a low-frequency design,
>> because the connecting inductance between the board and die filters out
>> the high-frequency noise. However, when signal quality may be impacted
>> by the plane resonances (for instance because the core plane is also
>> used as a return plane), it is a good idea to make a design that creates
>> a decent impedance profile up to the relevant bandwidth of the signal.
>>
>> Regards,
>> Istvan
>>
>> Chris Cheng wrote:
>>
>>
>>
>>
>>> Steve,
>>> What if the package of any IC act as a low pass filter that has a cut off
>>> at 100MHz or lower that seperate the fancy 80mohm PDN and the actual IC
>>> load ? What can all those highspeed caps and the transmission line planes
>>> do to help the IC ? At 100MHz or below, do I still need to worry about
>>> transmission line mode or just place the caps and regulator close enough
>>> and use a lump model ?
>>> If I look at the power decoupling requirements of the latest highspped
>>> CPU's, I am not sure if they even border to ask for 100MHz or above
>>> decoupling caps on the PCB other than for filters ?
>>> May be above 100MHz core power decoupling at system PCB level is not
>>> neccessary ?
>>> I certainly have done a few that suggest so.
>>> Chris
>>> _____
>>>
>>> From: si-list-bounce@xxxxxxxxxxxxx on behalf of steve weir
>>> Sent: Fri 3/14/2008 12:24 AM
>>> To: Joel Brown
>>> Cc: 'SILR'; 'Istvan Novak'; si-list@xxxxxxxxxxxxx
>>> Subject: [SI-LIST] Re: Antwort: Re: Questions about interplane capacitance
>>>
>>>
>>>
>>>
>>> Joel, a driver pumping into an infinitely long, or ideally terminated
>>> transmission line never sees a far end because no energy ever reflects
>>> back. A PDN that is arranged to look like an ideal infinite
>>> transmission structure, similarly reflects nothing back to the load.
>>> All the load sees is the characteristic resistive Z of the transmission
>>> structure it is attached to.
>>>
>>> Best Regards,
>>>
>>>
>>> Steve.
>>> Joel Brown wrote:
>>>
>>>
>>>
>>>
>>>
>>>> I hate to prolong this but...
>>>> When I think about a transmission line in the normal sense (signal
>>>> propagation), A driver switches at one end but initially all it sees is
>>>>
>>>>
>>>>
>>>>
>>>>
>>> Zo
>>>
>>>
>>>
>>>
>>>
>>>> which looks like a resistor maybe 50 ohms and it does not even see the
>>>>
>>>>
>>>>
>>>>
>>>>
>>> load
>>>
>>>
>>>
>>>
>>>
>>>> until wave propagates the length of the line. So there is a time delay..
>>>>
>>>>
>>>>
>>>>
>>>>
>>> Now
>>>
>>>
>>>
>>>
>>>
>>>> think of the driver being the power pin of the IC and the load being the
>>>> bypass cap on the corner of the board or visa versa and I see a
>>>>
>>>>
>>>>
>>>>
>>>>
>>> propagation
>>>
>>>
>>>
>>>
>>>
>>>> delay, so what am I missing?
>>>>
>>>> Joel
>>>>
>>>>
>>>> -----Original Message-----
>>>> From: SILR [ mailto:silr@xxxxxxxxxxxx]
>>>> Sent: Thursday, March 13, 2008 6:27 PM
>>>> To: 'steve weir'; 'Joel Brown'
>>>> Cc: 'Istvan Novak'; si-list@xxxxxxxxxxxxx
>>>> Subject: RE: [SI-LIST] Re: Antwort: Re: Questions about interplane
>>>> capacitance
>>>>
>>>> Joel asked:
>>>> <<< ...why is charge propagation velocity not a factor when the PDN is
>>>> purely resistive? >>>
>>>>
>>>>
>>>> Well, here's a crazy way to think about this (which I'm sure not
>>>>
>>>>
>>>>
>>>>
>>>>
>>> everyone
>>>
>>>
>>>
>>>
>>>
>>>> will agree)... I guess this would be like how Eric B. might put it...
>>>>
>>>>
>>>>
>>>>
>>>>
>>> "Be
>>>
>>>
>>>
>>>
>>>
>>>> the Signal"
>>>>
>>>>
>>>> I'm the charge on some corner of a board...there's an IC in the middle
>>>>
>>>>
>>>>
>>>>
>>>>
>>> of
>>>
>>>
>>>
>>>
>>>
>>>> the board...
>>>>
>>>> I have to get to that IC using this transmission line called the PDN.
>>>>
>>>>
>>>>
>>>>
>>>>
>>> If
>>>
>>>
>>>
>>>
>>>
>>>> this Transmission Line had the classical Ls and Cs (and Rs) to describe
>>>>
>>>>
>>>>
>>>>
>>>>
>>> its
>>>
>>>
>>>
>>>
>>>
>>>> characteristics, then that means I have to deal with changing EM fields
>>>>
>>>>
>>>>
>>>>
>>>>
>>> to
>>>
>>>
>>>
>>>
>>>
>>>> get to that IC... but these time varying EM fields always cause some
>>>>
>>>>
>>>>
>>>>
>>>>
>>> delay
>>>
>>>
>>>
>>>
>>>
>>>> in my charge getting to that IC in a timely manner...
>>>>
>>>> BUT!!! ...if this Transmission Line had nothing but Rs (no Ls and Cs) to
>>>> describe its characteristics then that means I don't have to deal with
>>>>
>>>>
>>>>
>>>>
>>>>
>>> time
>>>
>>>
>>>
>>>
>>>
>>>> varying EM fields any longer... I just have to deal with resistive
>>>>
>>>>
>>>>
>>>>
>>>>
>>> losses
>>>
>>>
>>>
>>>
>>>
>>>> only but this only equates to a drop in Static Voltage Potential and
>>>>
>>>>
>>>>
>>>>
>>>>
>>> nothing
>>>
>>>
>>>
>>>
>>>
>>>> more... (so keep the Z low!!!) And I can get there (to the IC) in no
>>>>
>>>>
>>>>
>>>>
>>>>
>>> time
>>>
>>>
>>>
>>>
>>>
>>>> and the IC gets the charges that it needs and it wouldn't even know
>>>>
>>>>
>>>>
>>>>
>>>>
>>> anything
>>>
>>>
>>>
>>>
>>>
>>>> is different...
>>>>
>>>> Again, this is a crazy way to look at this... but it works for me, for
>>>> now... until I get grilled by the senior members... :-)
>>>>
>>>> Silvester
>>>>
>>>> -----Original Message-----
>>>> From: si-list-bounce@xxxxxxxxxxxxx [ mailto:si-list-bounce@xxxxxxxxxxxxx]
>>>>
>>>>
>>>>
>>>>
>>>>
>>> On
>>>
>>>
>>>
>>>
>>>
>>>> Behalf Of steve weir
>>>> Sent: Thursday, March 13, 2008 5:57 PM
>>>> To: Joel Brown
>>>> Cc: 'Istvan Novak'; si-list@xxxxxxxxxxxxx
>>>> Subject: [SI-LIST] Re: Antwort: Re: Questions about interplane
>>>>
>>>>
>>>>
>>>>
>>>>
>>> capacitance
>>>
>>>
>>>
>>>
>>>
>>>> Joel, it is transmission line theory. Think about an infinitely long
>>>> signal transmission line for a moment. At any instant a driver sees a
>>>> constant impedance across frequency. The voltage to current relation is
>>>> independent of prior history. What Istvan describes is a very low
>>>>
>>>>
>>>>
>>>>
>>>>
>>> impedance
>>>
>>>
>>>
>>>
>>>
>>>> transmission structure for power.
>>>>
>>>> Sadly, a lot of IC vendors are still playing catch-up in terms of power
>>>> delivery. If they had their game together, they would be telling you:
>>>> The actual voltage tolerances at the die, the current spectrum at the
>>>>
>>>>
>>>>
>>>>
>>>>
>>> die,
>>>
>>>
>>>
>>>
>>>
>>>> and the parasitics of the die and package. From that you could engineer
>>>> your PDN. Instead often what we see are partial recipes like you
>>>>
>>>>
>>>>
>>>>
>>>>
>>> describe.
>>>
>>>
>>>
>>>
>>>
>>>> On a good day the recipes cost extra money. On a bad day, they result
>>>>
>>>>
>>>>
>>>>
>>>>
>>> in
>>>
>>>
>>>
>>>
>>>
>>>> failures.
>>>>
>>>> One can build a resistive networks several ways. One is to add discrete
>>>> resistance by any number of methods, another is to use the FDTIM method
>>>>
>>>>
>>>>
>>>>
>>>>
>>> that
>>>
>>>
>>>
>>>
>>>
>>>> Larry Smith has long championed. And even though resistive networks
>>>>
>>>>
>>>>
>>>>
>>>>
>>> have
>>>
>>>
>>>
>>>
>>>
>>>> attractive qualities, reactive networks may still be cheaper and equally
>>>> effective. It all depends on the circumstances. It is somewhat akin to
>>>> surface finishes: there is no ideal one. But there are several that
>>>>
>>>>
>>>>
>>>>
>>>>
>>> when
>>>
>>>
>>>
>>>
>>>
>>>> used properly work very well. One just needs to respect the limitations
>>>>
>>>>
>>>>
>>>>
>>>>
>>> of
>>>
>>>
>>>
>>>
>>>
>>>> each method.
>>>>
>>>> Part of the problem figuring this stuff out is having sufficient
>>>>
>>>>
>>>>
>>>>
>>>>
>>> experience
>>>
>>>
>>>
>>>
>>>
>>>> to judge trade-offs early in the design process. That's just something
>>>>
>>>>
>>>>
>>>>
>>>>
>>> that
>>>
>>>
>>>
>>>
>>>
>>>> has to be learned. As more training materials come out on power
>>>>
>>>>
>>>>
>>>>
>>>>
>>> delivery,
>>>
>>>
>>>
>>>
>>>
>>>> it will probably get easier. In the shameless plug department, we (
>>>> Teraspeed ) do very nice jobs optimizing power delivery systems for
>>>> customers. If you've got a design you want advice on we can get you
>>>> squared-up pretty quickly.
>>>>
>>>> Best Regards,
>>>>
>>>>
>>>> Steve.
>>>> Joel Brown wrote:
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> Steve,
>>>>>
>>>>> So even though each cap has a relatively high ESR (1.6 Ohms) the PDN
>>>>> as a whole has a relatively low impedance which will result in low
>>>>> noise on the PDN. This goes against intuition and previous thinking
>>>>> that an IC needs a local bypass with low ESR and ESL to supply the
>>>>> needed charge during switching transients. I am starting to see that
>>>>> mathematically a resistive PDN lowers noise compared to one that is
>>>>> the inductive (you did a good job explaining that). The thing that I
>>>>> am having trouble grasping or
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> visualizing
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> is that why is charge propagation velocity not a factor when the PDN
>>>>> is purely resistive? Is the PDN model simply a resistor in series with
>>>>> the
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> load
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> and distance has no effect? Perhaps there is an analogy that would
>>>>> make
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> this
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> concept easier to understand? Also, when I see app notes from IC
>>>>> vendors that recommend using a 0.1uF and 1000pF cap on each supply pin
>>>>> and then instead I use distributed high ESR capacitors I feel like I
>>>>> am doing something quite different and contrary from the recommended
>>>>> and when I
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> query
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> the vendors on how they arrived at recommendations in the app note the
>>>>> answer I get is "we recommend that you do it exactly as shown in the
>>>>> app note, we know it works that way and if you don't follow it it may
>>>>> not
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> work".
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> Also I am wondering how all this relates to X2Y caps, I suppose they
>>>>> could be used with series resistors but that would somewhat defeat the
>>>>> purpose
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> by
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> adding inductance. Its not clear to me what approaches I should
>>>>> attempt on future designs.
>>>>>
>>>>> Joel
>>>>>
>>>>>
>>>>> -----Original Message-----
>>>>> From: si-list-bounce@xxxxxxxxxxxxx
>>>>> [ mailto:si-list-bounce@xxxxxxxxxxxxx]
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> On
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> Behalf Of steve weir
>>>>> Sent: Wednesday, March 12, 2008 11:26 PM
>>>>> To: Doug Brooks
>>>>> Cc: Istvan Novak; si-list@xxxxxxxxxxxxx
>>>>> Subject: [SI-LIST] Re: Antwort: Re: Questions about interplane
>>>>> capacitance
>>>>>
>>>>> Doug, Istvan's representations are analytically exact. When the
>>>>> characteristic impedance of the transmission structure is high, and/or
>>>>> the rise times are slow then capacitors can be placed in close enough
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> proximity
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> that they load the transmission structure so as to make it appear a
>>>>> lower impedance with some little bumps. For example if one had a 10"
>>>>> x 10" 4
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> mil
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> er4.0 board = 22.5nF and loaded it with bypass every square inch of
>>>>> 150pH, then for slow enough signals, the distributed impedance would
>>>>> look like 80mOhms. If the network were constructed from 200
>>>>> capacitors, an ESR
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> value
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> of 1.6Ohms / cap would make that impedance uniform down to the RC knee
>>>>> of the parts. Assume that were matched by an AVP regulator of 80mOhms
>>>>> and
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> the
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> entire thing looks like 80mOhms from DC to over 1GHz. 80mOhms would
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> support
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> a 32 bit transition w/ about 5% droop. The impedance scales with
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> dielectric
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> height and the inverse square root of eR. Scale the dielectric down
>>>>> to 0.1mils and now 320 lines can switch simultaneously in one
>>>>> direction with
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> 5%
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> droop, and at arbitrary edge rates.
>>>>>
>>>>> Istvan has shown using analysis with the reverse pulse technique an
>>>>> inductive PDN shunt impedance acts like a noise high pass filter (
>>>>> See DC papers from at least as far back as DC East 2005 ). Put in a
>>>>> square wave noise pulse ( load current ) and the leading edge changes
>>>>> by Vdelta = -L*di/dt below the baseline. Allow the pulse to persist
>>>>> long enough and
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> the
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> system recovers back to the baseline which would be -I*Rpdn.
>>>>> Return the load current to zero, and now the energy stored in the
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> inductance
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> kicks back -L*di/dt. The p-p noise is then 2*Ldi/dt -
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>> (Imax-Imin)*Rpdn.
>>>
>>>
>>>
>>>
>>>
>>>> If
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> Rpdn is very small then it approximates 2*Ldi/dt.
>>>>> This behavior is apparent in the transient response plots of virtually
>>>>> any non-AVP VRM.
>>>>>
>>>>> Now, suppose that the VRM and PDN can be made to appear resistive
>>>>> right through Fknee. Then the response to a current pulse of I is
>>>>> simply Vdelta
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> =
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> -I*Rpdn. There is no component of di/dt, and so the total p-p noise
>>>>> is
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> just
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> (Imax - Imin)*Rpdn. AVP schemes position the DC operating point
>>>>> intentionally high so that at Imin they are at their margined high
>>>>> limits and at Imax they are at their low limits. This allows
>>>>> increasing Rpdn
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>> while
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>> still meeting the same current and voltage specifications.
>>>>>
>>>>> Best Regards,
>>>>>
>>>>>
>>>>> Steve.
>>>>>
>>>>>
>>>>> Doug Brooks wrote:
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>> Istvan,
>>>>>>
>>>>>> With all due respect, I would modify your argument a little bit. In
>>>>>> very simplistic terms, suppose we need x amount of charge to
>>>>>> transition from a zero to a one in one ns. That amount of charge (I
>>>>>> suggest) must be within
>>>>>> 6 inches of the need (what I think we are referring to as the service
>>>>>> radius). If not, it takes a little longer to reach the logical one
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>> state.
>>>
>>>
>>>
>>>
>>>
>>>>>> I look at it, not from the standpoint of a dip in the rail, as much
>>>>>> as the ability to satisfy the rise time requirement (unless you are
>>>>>> referring to a dip in the rail that occurs during the rise time
>>>>>> itself.) In the slightly longer term, the charge will replenish
>>>>>> fairly quickly, but not, perhaps fast enough to meet the rise time
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>> requirement.
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>>> Doug Brooks
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>> Andreas,
>>>>>>>
>>>>>>> Yes and no. It is true that charge moves with finite speed, so for
>>>>>>> any given time duration the charge has to come from locations closer
>>>>>>> than the ratio of distance over speed. BUT the whole notion of
>>>>>>> service radius is based on the assumption that as you deplete the
>>>>>>> charge available in the immediate vicinity of the active device, you
>>>>>>> have to wait for replenishment, otherwise you get a big dip on the
>>>>>>> supply rail.
>>>>>>>
>>>>>>> Having a matched
>>>>>>> transmission medium to deliver power to the active device, the
>>>>>>> charge moves without interruption, and as you deplete the planes
>>>>>>> close to the device, it gets replenished on the fly from areas
>>>>>>> further away, so the service area concept is pretty much meaningless
>>>>>>> in this scenario. Current flows without interruption.
>>>>>>> The bucket brigade of infinitesimally small inductive and capacitive
>>>>>>> elements of the transmission line transmits the power continuously.
>>>>>>> If the load current changes, for any I(t) time function of load
>>>>>>> current, the transient noise at the load point will be I(t)*Zo,
>>>>>>> where we assume that Zo is the resistive and frequency independent
>>>>>>> characteristic impedance of the transmission medium. This is a very
>>>>>>> simplistic one-dimensional model, but it gives a good insight of why
>>>>>>> the service radius matters only on PDNs where the network is not
>>>>>>> matched.
>>>>>>>
>>>>>>> Regards,
>>>>>>>
>>>>>>> Istvan Novak
>>>>>>> SUN Microsystems
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>> Andreas.Lenkisch@xxxxxxxxxx wrote:
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>
>>>>>>>> Istvan,
>>>>>>>> I'm wodering a little about your comments to the service radius.
>>>>>>>> Independant if the impedance is resistive, we have still a
>>>>>>>> propagation time which would limit the service radius from my
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>> understanding.
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>
>>>>>>>> Do I'm wrong?
>>>>>>>>
>>>>>>>> regards
>>>>>>>> Andreas
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>> Istvan Novak <istvan.novak@xxxxxxxxxxx> Gesendet von:
>>>>>>>> si-list-bounce@xxxxxxxxxxxxx
>>>>>>>> 11.03.2008 13:14
>>>>>>>>
>>>>>>>> An
>>>>>>>> Joel Brown <joel@xxxxxxxxxx>
>>>>>>>> Kopie
>>>>>>>> si-list@xxxxxxxxxxxxx
>>>>>>>> Thema
>>>>>>>> [SI-LIST] Re: Questions about interplane capacitance
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>> Joel,
>>>>>>>>
>>>>>>>> Just one quick comments to the good summary from Steve:
>>>>>>>>
>>>>>>>> While considering planes and bypass capacitors in terms of
>>>>>>>> effective capacitances and inductances is a valid approach, we need
>>>>>>>> to keep in mind that focusing on the capacitive or inductive nature
>>>>>>>> of parts without looking at the wider picture misses a very
>>>>>>>> important and useful class of solutions, namely that of matched
>>>>>>>> transmission lines. As it was pointed out earlier several times on
>>>>>>>> the SI list, the best
>>>>>>>> (self) impedance for a power distribution network is a resistive
>>>>>>>> one, neither capacitive, nor inductive.
>>>>>>>> We can get resistive impedance from a matched transmission line,
>>>>>>>> regardless of its capacitance and inductance, and in such cases the
>>>>>>>> notion of 'service area' of parts become meaningless: you can put
>>>>>>>> bypass components further away from the active devices without
>>>>>>>> sacrificing performance.
>>>>>>>>
>>>>>>>> Regards,
>>>>>>>>
>>>>>>>> Istvan Novak
>>>>>>>> SUN Microsystems
>>>>>>>>
>>>>>>>> Joel Brown wrote:
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> Interplane capacitance is frequently cited as the only effective
>>>>>>>>> bypass capacitance on a PCB at frequencies above 200 MHz.
>>>>>>>>> I am currently working on a design which brings up some questions
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> regarding
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> interplane capacitance.
>>>>>>>>>
>>>>>>>>> 1. Power planes normally carry "standard" voltage rails that are
>>>>>>>>> used throughout a board such as +5V and +3.3V.
>>>>>>>>> High speed ICs usually have core voltages that are local to the IC
>>>>>>>>> and
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> are
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> provided by a local regulator which converts the standard rail to
>>>>>>>>> the
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> core
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> voltage (example 3.3 to 1.8V).
>>>>>>>>> The local core voltage is distributed on a plane area that is
>>>>>>>>> local to
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> the
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> IC and therefore is small in area (0.25 sq in or less) which
>>>>>>>>> results in
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> a
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> very small amount of interplane capacitance.
>>>>>>>>> Is this very small amount of capicitance effective for bypassing
>>>>>>>>> the IC?
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> I
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> am sure it depends somewhat on the current waveform being drawn by
>>>>>>>>> the
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> IC
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> but this can only be estimated because semiconductor manufacturers
>>>>>>>>> do
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> not
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> provide current consumption profile as a function of frequency. To
>>>>>>>>> make matters worse, some ICs have several different VCC pins which
>>>>>>>>> the manufacturer recommends connecting to separate networks of
>>>>>>>>> bypass caps
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> and
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> ferrite beads. This cuts the power distributuion up even more
>>>>>>>>> resulting
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> in
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> less (practically zero) interplane capacitance. It is somewhat
>>>>>>>>> ironic
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> that
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> the the voltages such as +5V and +3.3V which are required at
>>>>>>>>> points
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> across
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> the whole board and therefore have the most interplane capacitance
>>>>>>>>> are
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> also
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> the voltages which have least requirement for interplane
>>>>>>>>> capacitance
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> because
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> they do not directly supply high speed rails.
>>>>>>>>>
>>>>>>>>> 2. There has been a lot of emphasis on reducing the mounted
>>>>>>>>> inductance
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> of
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> bypass capacitors. Even with this reduced inductance they are
>>>>>>>>> still only effective up to several hundereds of MHz at which point
>>>>>>>>> the interplane capacitance becomes the only bypass capacitance
>>>>>>>>> mechanism. However there
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> is
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> inductance between the connection of the IC to the planes. This
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> inductance
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> consists of vias and package inductance. I did look for some
>>>>>>>>> numbers for package inductance and did not find much, it seems to
>>>>>>>>> be a closely held secret. Also it is unknown how much bypass
>>>>>>>>> capacitnace is internal to
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> the IC
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> package. Just for example if we assume 250pH for the vias and 500
>>>>>>>>> pH for
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> the
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> package, then the impedance at 500 MHz would be 2.36 Ohms. This
>>>>>>>>> seems
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> rather
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> high for the interplane capacitance to be of much benefit.
>>>>>>>>>
>>>>>>>>> In summary how much interplane capacitance is needed to be
>>>>>>>>> beneficial,
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>> and
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>
>>>>>>>>> why is it beneficial given the inductance in the vias and package?
>>>>>>>>>
>>>>>>>>> Thanks - Joel
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
>>>>>>>>>
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>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>> --
>>>>> Steve Weir
>>>>> Teraspeed Consulting Group LLC
>>>>> 121 North River Drive
>>>>> Narragansett, RI 02882
>>>>>
>>>>> California office
>>>>> (408) 884-3985 Business
>>>>> (707) 780-1951 Fax
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>>> ----
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>>>>> --------------------------
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>>>>>
>>>> --
>>>> Steve Weir
>>>> Teraspeed Consulting Group LLC
>>>> 121 North River Drive
>>>> Narragansett, RI 02882
>>>>
>>>> California office
>>>> (408) 884-3985 Business
>>>> (707) 780-1951 Fax
>>>>
>>>> Main office
>>>> (401) 284-1827 Business
>>>> (401) 284-1840 Fax
>>>>
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>>>> This e-mail contains proprietary and confidential intellectual property
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>>>>
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>>> of
>>>
>>>
>>>
>>>
>>>
>>>> Teraspeed Consulting Group LLC
>>>> ------------------------------------------------------------------------
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>>>>
>>>>
>>> ----
>>>
>>>
>>>
>>>
>>>
>>>> --------------------------
>>>> Teraspeed(R) is the registered service mark of Teraspeed Consulting
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>>>>
>>>>
>>>>
>>> Group
>>>
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>>>
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>>> --
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>>> Teraspeed Consulting Group LLC
>>> 121 North River Drive
>>> Narragansett, RI 02882
>>>
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>>> (408) 884-3985 Business
>>> (707) 780-1951 Fax
>>>
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