FreeLists / si-list / [SI-LIST] Re: Current capacity of a Solder Ball

[Brian Schieck <BSchieck@xxxxxxxxxx>]

All I want is the current capacity.

Consider power delivery

Balls > Plane > Wires or Bumps

If my IC needs 20 Amps DC for core support how many bumps are needed to 
supply this? I know the capacity of the ball pads on the bottom 
(cu thickness / width / size ). I know a blind via (filled can carry 400 ma)
and I can use multiple vias / ball pad/.
I know the planes can handle more than 20 AMPS. I know if 
it is Wirebond each 0.9 mil wire can handle 900 ma. So how much can a ball 
carry underrated? I'll figure out what I would like to apply as a derating
i.e. the addition of balls till I'm comfortable with the power delivery.

I want to design quantity of Balls to a real spec. I want to decide my
margin.
I know that 400 ma is bull. Balls can pull AMPS.

Brian Schieck
NVidia Corporation
2701 San Tomas Expressway MS B22-221
Santa Clara, California   95050
Direct Phone #  (408) 486-2697
Corp Phone   #  (408) 486-2000 x62697
Local Fax    #  (408) 486-8078
Corp  Fax    #  (408) 486-2200

Email        bschieck@xxxxxxxxxx


-----Original Message-----
From: James.Freeman@xxxxxxxxxxxx [mailto:James.Freeman@xxxxxxxxxxxx]
Sent: Wednesday, February 05, 2003 4:30 PM
To: Brian Schieck
Subject: RE: [SI-LIST] Current capacity of a Solder Ball


Hi Brian,
        How are things. Are you looking at a bump or a ball for this info?

Jim Freeman

-----Original Message-----
From: Brian Schieck [mailto:BSchieck@xxxxxxxxxx] 
Sent: Wednesday, February 05, 2003 11:13 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Current capacity of a Solder Ball



Does any one know what the current carrying capacity of a solder ball is?
How is the capacity determined? Is the capacity derated to account for
temperature and voids?


for a 60 mil solder ball.

Brian Schieck
NVidia Corporation
2701 San Tomas Expressway MS B22-221
Santa Clara, California   95050
Direct Phone #  (408) 486-2697
Corp Phone   #  (408) 486-2000 x62697
Local Fax    #  (408) 486-8078
Corp  Fax    #  (408) 486-2200

Email        bschieck@xxxxxxxxxx
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