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[SI-LIST] Re: Current capacity of a Solder Ball
- From: "Ozgur Misman" <omism@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 5 Feb 2003 15:35:40 -0700
Hi All,
I certainly agree with some of the authors that the current carrying
capability of a solderball can not be solely determined by considering the
solderball as a seperate entity.
The current capacity could mainly be influenced by the quality and the
metallurgy of the Solderball/ soderballpad interface.
My question would be whether the ball falls off before it melts?
By the way, I have not come across any technical paper on this issue,
although I have been looking for it for some time.
If anybody has any reference that points out to measured data. PLease
forward a copy to me , I would be very interested.
Regards,
Ozgur Misman
Aubrey_Sparkman@xxxxxxxx@freelists.org on 02/05/2003 02:39:48 PM
Please respond to Aubrey_Sparkman@xxxxxxxx
Sent by: si-list-bounce@xxxxxxxxxxxxx
To: weirsp@xxxxxxxxxx, mchan@xxxxxxxxxxx, BSchieck@xxxxxxxxxx,
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Subject: [SI-LIST] Re: Current capacity of a Solder Ball
Steve,
Let's assume that all your numbers are correct. I had the same conclusion
several years ago at a previous company. We both missed the main point of
Pat's email: You need to re-think what the limiting factor is. It's not
immediately obvious.
Aubrey Sparkman
Signal Integrity
Aubrey_Sparkman@xxxxxxxx
(512) 723-3592
> -----Original Message-----
> From: steve weir [mailto:weirsp@xxxxxxxxxx]
> Sent: Wednesday, February 05, 2003 3:07 PM
> To: mchan@xxxxxxxxxxx; BSchieck@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Current capacity of a Solder Ball
>
>
>
> Moses, and Brian, that current number seems low by orders of
> magnitude. First, the electrical resistance is way off. For the
> resistivity value shown which seems about right at 8X Cu, and
> a rectangular
> section 0.2mm X 0.2mm X 0.6mm yields about 0.002 ohms.
>
> Similarly, the thermal resistance value of 41,000 C/W for a
> metallic object
> 24 thousandths thick cannot be right. Take a small glob of
> solder the size
> of a BGA ball on the bench and connect it to a 10V supply and
> a 100 ohm
> resistor. There is no way, that blob will get warm, much
> less melt. It
> will take multiple amperes to melt the foil leading to or
> away from the
> ball, and the foil will fail long before the ball.
>
> Regards,
>
>
> Steve.
>
> At 11:32 AM 2/5/2003 -0800, Moses Chan wrote:
>
> >Hi Brian,
> >
> >I asked the same question to the list a few months back and got the
> >following answer, below:
> >
> >Solder Ball (63Sn/37Pb) 0.0006 m
> >Ambient Temp. 34 Deg. C
> >Melting Temp. 189 Deg. C
> >Thermal Conductivity 50 W/m-C
> >Electrical Resistivity 0.000000145 ohm-m
> >Thermal Resistance 41026.51161 C/W
> >DC Electrical Resistance 0.297442209 ohm
> >Total Resistance 0.297442209 ohm
> >Power to Melt 0.003778045 W
> >Current to Melt 0.112702164 Amps
> >
> >
> >Moses Chan
> >Vitesse Semiconductor
> >Camarillo, California
> >
> >At 11:13 AM 2/5/03 -0800, Brian Schieck wrote:
> >
> > >Does any one know what the current carrying capacity of a
> solder ball is?
> > >How is the capacity determined?
> > >Is the capacity derated to account for temperature and voids?
> > >
> > >
> > >for a 60 mil solder ball.
> > >
> > >Brian Schieck
> > >NVidia Corporation
> > >2701 San Tomas Expressway MS B22-221
> > >Santa Clara, California 95050
> > >Direct Phone # (408) 486-2697
> > >Corp Phone # (408) 486-2000 x62697
> > >Local Fax # (408) 486-8078
> > >Corp Fax # (408) 486-2200
> > >
> > >Email bschieck@xxxxxxxxxx
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