Yes, that is true there is a circuit behind the ball
consisting of trace, A bondwire or a flipchip bump
and the I/O on the die.
The system needs to be balanced or one of those ends up being the FUSE. BAD!
I was curious about just the ball. Trace sizing for power if fairly common
and the I/O I don't have that much control of anyway.
I can and will get a spec from the targeted vendor but I comes with
derating and padding and I may want to adjust that to my needs.
Brian Schieck
NVidia Corporation
2701 San Tomas Expressway MS B22-221
Santa Clara, California 95050
Direct Phone # (408) 486-2697
Corp Phone # (408) 486-2000 x62697
Local Fax # (408) 486-8078
Corp Fax # (408) 486-2200
Email bschieck@xxxxxxxxxx
-----Original Message-----
From: Clewell, Craig [mailto:cclewell@xxxxxxxxxxxxxx]
Sent: Wednesday, February 05, 2003 11:49 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Current capacity of a Solder Ball
Brian,
I would think that the solder ball must attach to something and that
something more than likely has a current carrying capacity. Would it help
if you thought of the ball + something as a system and obtained the rating
for the said something?
Craig
-----Original Message-----
From: Moses Chan [mailto:mchan@xxxxxxxxxxx]
Sent: Wednesday, February 05, 2003 2:33 PM
To: BSchieck@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Current capacity of a Solder Ball
Hi Brian,
I asked the same question to the list a few months back and got the
following answer, below:
Solder Ball (63Sn/37Pb) 0.0006 m
Ambient Temp. 34 Deg. C
Melting Temp. 189 Deg. C
Thermal Conductivity 50 W/m-C
Electrical Resistivity 0.000000145 ohm-m
Thermal Resistance 41026.51161 C/W
DC Electrical Resistance 0.297442209 ohm
Total Resistance 0.297442209 ohm
Power to Melt 0.003778045 W
Current to Melt 0.112702164 Amps
Moses Chan
Vitesse Semiconductor
Camarillo, California
At 11:13 AM 2/5/03 -0800, Brian Schieck wrote:
>Does any one know what the current carrying capacity of a solder ball is?
>How is the capacity determined?
>Is the capacity derated to account for temperature and voids?
>
>
>for a 60 mil solder ball.
>
>Brian Schieck
>NVidia Corporation
>2701 San Tomas Expressway MS B22-221
>Santa Clara, California 95050
>Direct Phone # (408) 486-2697
>Corp Phone # (408) 486-2000 x62697
>Local Fax # (408) 486-8078
>Corp Fax # (408) 486-2200
>
>Email bschieck@xxxxxxxxxx
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