FreeLists / si-list / [SI-LIST] package models

["Carlos Moll" <cmoll@xxxxxxxxxxx>]

There is noticeable changes in today's requirements for package modeling =
and the distribution formats of such models.   To keep it simply, =
lumped, narrow bandwidth, uncoupled package models are no longer =
supporting the level of accuracy needed for dealing with high speed =
design issues.  Additionally, an end goal would be to support concurrent =
Chip-Package-PCB design.

There are various model types available (just looking for format info at =
this point, which would be irrelevant on the solvers used and whether =
flipchip or wirebond technology)

Some examples;
Lumped, uncoupled
Lumped, Coupled
Distributed t-line=20
PEEC Based....
with a wide range of formats (ebd, dml, spice, s-param, etc..) which =
could be used either in the time domain or frequency domain or both....=20

So, the question would be what would be the preferred format for =
supporting the more advanced, coupling based package models?

Thank you for the input.

Carlos Moll
Cadence Design Systems, Inc.
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
http://www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field

List archives are viewable at:     
                http://www.freelists.org/archives/si-list
or at our remote archives:
                http://groups.yahoo.com/group/si-list/messages 
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu